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[Case 2] Micromachining Technology for Backside Illuminated X-ray Image Sensors

Maximizing the opening rate with 1 million corner hole formations. Challenging the limits of semiconductor wafer processing.

The realization of high-sensitivity sensors requires extremely precise wafer processing technology to expand the light-receiving area. We conducted a special processing to form 1 million square holes with a 100µm pitch on a Φ200mm photodiode wafer. By maintaining square holes of 90µm and a thin wall structure of 10µm, we achieved an overwhelming large aperture ratio and successfully enhanced sensitivity. This is a fine processing solution unique to Connectec Japan, utilizing deep dry etching (DRIE) on silicon wafers. *The accuracy of wafer processing and detailed specifications are available in the downloadable materials.